Lead and strategize 300mm bumping process engineering, ensuring high yield, quality, and process innovation. Collaborate with cross-functional teams to drive technical and operational excellence.Key Responsibilities:Provide leadership and strategic direction for the bumping engineering teamOversee development, optimization, and qualification of 300mm bumping processesExecute technology roadmap and stay ahead of industry trendsCollaborate with manufacturing, quality, equipment engineering, and R&D teamsManage personnel, equipment, and budget to meet departmental goalsFoster innovation and continuous process improvementIdentify and mitigate process risks to ensure production qualityIdeal Requirements:Bachelor's in Engineering, Physics, Materials Science, or related field10-12+ years experience in bumping engineering or 300mm wafer processingIf you would like to be considered for this opportunity, please forward a copy of your full CV to melissa.lin@ambition.com.sgData provided is for recruitment purposes only. Only shortlisted candidates will be notified.Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer SGD1,000 or SGD350 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.Sign up for job alertsIf you are a human, ignore this field Create alertYou agree to ourShare this job[Semiconductor Packaging] Bumping Process ManagerSingapore Posted 2 days agoQuick LinksConnectWe are committed to Building Better Futures for the organisations we work for, the professionals we help, and our own employees.
