Senior Manager, Advanced Packaging Process and Product Integration (Experiences in Front End, Post Wafer Fabrication (PWF), High Bandwidth Manufacturing Technology)
Building an Effective Team Members and Managing Group Performance Develop a high performing team. Establish department objectives aligned to company strategic objectives and goals. Prioritize objectives, remove barriers, and drive for accountability. Establish job responsibilities, performance goals and development goals for direct reports. Provide performance feedback on an on-going basis and conduct performance appraisal for direct reports. Collect, review, and provide verbal and written performance feedback to continuously develop your team. Optimize department performance and structure. Monitor and oversee department performance achievement and provide timely intervention on initiatives that needs help. Assess talent and develop talent management strategies. Support learning opportunities within department and plan development opportunities for direct reports. Provide consultation or implement timely intervention to prevent or resolve conflicts with minimal noise. Establish strategies to provide and support recognition. Promote and oversee partnerships across functional areas and customer groups. Uses communication skills to resolve sensitive or difficult issues Provide organizational leadership to build functional strategies & processes, and collaborate with partners to deliver strategic solutions Establish organizational roadmaps and strategies. Apply extensive knowledge and tenacity to carry out strategies. Develop and monitor department performance to plan. Develop and measure department metrics and oversee functional metrics to ensure deliverables are met. Collaborate with peers to construct global solutions. Ensure conflict resolution and assist with identifying critical issue paths. Establish and communicate department capabilities to ensure partner expectations are aligned. Manage conflict and build effective relationships with internal and external partners. Initiate and sustain effective communication with internal and external partners. Provide advice to senior and executive management on strategic decisions Establishes and manages budget/finances for the team Evaluate new risk identified with new products and provide engineering solutions and train workforce, if necessary Working with engineering team on any issues/ problems, potential risk & opportunities Oversee the development and optimization of semiconductor packaging processes specific to Advance Packaging in your area of ownership and collaborating with team members & partners in other areas of HBM modules (Chemical/Plasma, Deposition, Stack & Bond, Wafer Prep, Thermal, Inspection) to ensure high yield and quality standards are met. Perform process and tool capability assessment. Assess & validate CTQ (critical to quality). Define and implement the necessary quality system and documentation, encompassing initial design to full-scale production. Coordinate and implement NPI samples build, and engineering samples build during NPI qualification. Accountable in improving the yield, quality and reliability through proper process definition, characterization and optimization. Work with cross functional team for a successful process/equipment/material development, CIP, and on other key strategic projects & programs implementation. Manage the selection, installation, and maintenance of equipment necessary for Advance Packaging. Collaborate with vendors and internal teams. Identify risks and mitigation plans with partners & alignment with cross functional teams. Drive programs to satisfactory conclusion. Identify, diagnose and resolve issues during NPI phase by applying problem solving skills Develop and manage budgets for facility operations, including forecasting, cost controls, and resource allocation. Bachelors/ Master in Electrical Engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus. 8 or more years of experience with proven track record of technical leadership in semiconductor manufacturing, with expertise in Front End, Post Wafer Fabrication (PWF), High Bandwidth Manufacturing technology, process development, and/or equipment management. Strong leadership and vision and must be able to comfortably work across organizational boundaries and geographies. Able to influence senior leaders and partners on tactical decisions across multiple functions and geographies. Ability to effectively collaborate with cross-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements. Able to drive and implement a wide range of global initiatives with global teams. Organized, meticulous, and strong focus on results. Able to inspire teamwork and to effectively lead others. Proven facilitation skills including the ability to influence others, build consensus, and resolve conflict. Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method. Excellent analytical skills and organizational competency With good oral and written communication skill
