Job Description:SummaryTo lead the development, optimization, and stabilization of temporary bonding and debonding (TBDB) processes for advanced packaging applications, ensuring seamless integration with downstream processes and meeting product reliability and quality requirements.JobDevelop and optimize TBDB processes for various wafer-level packaging applicationsSelect appropriate materials (e.g., adhesives, carriers) and stabilize related process conditionsDesign integrated process flows including wafer thinning, bonding, and debondingAnalyze compatibility with downstream processes and perform process tuning accordinglyInvestigate and resolve defect issues such as voids, warpage, and delaminationCoordinate TBDB equipment installation and optimize process parametersPropose customized process solutions based on customer product and reliability requirementsSupports advanced semiconductor packaging processes requiring TBDB integrationDirectly impacts yield stabilization, customer qualification, and new product introduction (NPI)Plays a key role in cross-process compatibility and back-end process integrationRequirementBachelors degree or higher in engineering disciplines such as Materials Science, Mechanical Engineering, Chemical Engineering, Electronics, or Advanced MaterialsMinimum 3 years of hands-on experience in TBDB process developmentUnderstanding of material properties for adhesives, carriers, and thermal interface materialsKnowledge of bonding techniques under high temperature and pressure, including heat transfer, stress, and interfacial behaviourFamiliarity with semiconductor back-end or advanced packaging process flowsStrong skills in experiment design, data analysis, and process documentationExcellent problem-solving and root cause analysis capabilities in process-related issuesExperience in advanced packaging technologies such as 2.5D/3D, TSV, CoWoS, and fan-outHands-on experience with TBDB equipment operationKnowledge of adhesive and laser debonding techniquesProven experience in cross-process integration and process optimizationUnderstanding of reliability evaluation and qualification standardsAll Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.Please email your resume in a detailed MS Word format to stating1) Current Drawn2) Expecting Salary3) Date Available4) Reason to Leave each job:We regret that only shortlisted candidates will be notifiedJoyce Koh Ai LengPeople Profilers Pte Ltd20 Cecil St, #08-09, PLUS Building, Singapore 049705Tel: 6950 9737EA License Number: 02C4944EA Personnel Reg nos R1110618Job ID:People Profilers Pte Ltd (People Profilers) has entered into a Partnership Recruitment Collaboration with Employment and Employability Institute Pte Ltd (e2i), to extend the support of hiring beyond e2is resources to broaden the reach of jobseekers.This is in partnership with the Employment and Employability Institute Pte Ltd (e2i).e2i is the empowering network for workers and employers seeking employment and employability solutions. e2i serves as a bridge between workers and employers, connecting with workers to offer job security through job-matching, career guidance and skills upgrading services, and partnering employers to address their manpower needs through recruitment, training, and job redesign solutions. e2i is a tripartite initiative of the National Trades Union Congress set up to support nation-wide manpower and skills upgrading initiatives. By applying for this role, you consent to People Profilerss PDPA and ( ).
