Job Description:SummaryTo lead the development, optimization, and stabilization of plating and etching processes for advanced semiconductor packaging, contributing to mass production readiness, yield improvement, and customer-specific technical solutions.JobDevelop and optimize electroplating, seed etching, and PR stripping processesDesign and improve processes for TSV, RDL, Cu pillar, and micro bump formationEvaluate and introduce new materials and equipment for plating/etching process integrationConduct pre-production process validation and yield stabilizationPerform DOE planning and analyze experimental data using statistical tools (e.g., SPC, Minitab, JMP)Develop customized processes and provide technical support for customer programsSet up equipment and optimize operating conditions in coordination with vendorsTroubleshoot quality issues across plating and etching processesSupport development of advanced packaging technologies including 2.5D, fan-out, and SiPSupports high-volume semiconductor packaging processes in plating and etchingContributes directly to process yield, quality improvement, and customer technical satisfactionDrives technical innovation in advanced packaging technologies in alignment with global customer programsRequirementBachelors degree or higher in Engineering or Science (e.g., Materials Science, Chemistry, Chemical Engineering, Electronics, Advanced Materials)Minimum 3 years of hands-on experience in plating, etching, or stripping processes in semiconductor manufacturingFundamental understanding of advanced semiconductor fabrication and integration processesStrong skills in experiment design, statistical data analysis (e.g., SPC, Minitab, JMP), and technical reportingProficiency in preparing technical documentation and delivering presentationsAbility to communicate technical content clearly in English (written and verbal)Basic knowledge of semiconductor process equipment and materialsExperience in key back-end processes such as TSV, RDL, and micro bumpKnowledge of advanced packaging technologies including 2.5D, fan-out, and flip-chipFamiliarity with related processes such as photo, chip attach, and underfillProven experience in joint development projects with global customersHands-on collaboration with material or equipment suppliers for co-evaluation or integrationExpertise in process reliability testing (e.g., thermal cycling, HAST)Experience in process automation or smart fab environmentsWorking proficiency in tools such as AutoCAD or ANSYSIn-depth understanding of etch/strip conditions for back-end photoresist materialsAll Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.Please email your resume in a detailed MS Word format to stating1) Current Drawn2) Expecting Salary3) Date Available4) Reason to Leave each job:We regret that only shortlisted candidates will be notifiedJoyce Koh Ai LengPeople Profilers Pte Ltd20 Cecil St, #08-09, PLUS Building, Singapore 049705Tel: 6950 9737EA License Number: 02C4944EA Personnel Reg nos R1110618Job ID:People Profilers Pte Ltd (People Profilers) has entered into a Partnership Recruitment Collaboration with Employment and Employability Institute Pte Ltd (e2i), to extend the support of hiring beyond e2is resources to broaden the reach of jobseekers.This is in partnership with the Employment and Employability Institute Pte Ltd (e2i).e2i is the empowering network for workers and employers seeking employment and employability solutions. e2i serves as a bridge between workers and employers, connecting with workers to offer job security through job-matching, career guidance and skills upgrading services, and partnering employers to address their manpower needs through recruitment, training, and job redesign solutions. e2i is a tripartite initiative of the National Trades Union Congress set up to support nation-wide manpower and skills upgrading initiatives. By applying for this role, you consent to People Profilerss PDPA and ( ).
