Your responsibilities will include, but are not limited to, the following: Improve current process flows and develop innovative solutions to meet product requirements and manufacturability. Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability. Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners. Establish proof of concept for future tech nodes at the manufacturing facility. Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing. Passionate about semiconductor technology and innovation. Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms. Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment. BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field.
