Your responsibilities will include, but are not limited to, the following: Improve current process flows and develop innovative solutions to meet product requirements and manufacturability. Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability. Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners. Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility. Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams. Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing. Successful candidates for this position will have: Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable. Minimum of 3 years of experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement. Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms. In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable. Exposure to R&D and transfer/manufacturing is desirable. Committed to quality, collaboration, and continuous improvement. Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment. Extended travel to the US spanning several months to a year will be a requirement for the role. BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field. N180 Hiring JD - Internal N180 NTI NAND Senior/Principal Process Integration Engineer Our vision is to transform how the world uses information to enrich life for all. Your responsibilities will include, but are not limited to, the following: Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability. Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability. Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners. Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility. Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams. Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing. Passionate about semiconductor technology and innovation. Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms. Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment. BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field.
