Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements Ensure defense coverage through process, measurement, inspection, and testing Establish correlations between defense mechanisms to identify improvement opportunities Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control Ensure smooth transition from new product development, qualification, small volume production to high volume production Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields Passion and interest in semiconductor process integration. Know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes would be beneficial. Understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team Ability to resolve complex issues through root-cause or model-based problem solving Tenacity to work effectively under timelines and limited resources Consistent track record to solve problems and address root causes. Innovation, Tenacity, Collaboration and Customer Focus
