Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer. Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity Establish and improve process management projects to deliver technology node requirements Evaluate and promote new equipment and materials to enhance process capabilities Set up process parameters for a variety of semiconductor equipment Evaluate, promote, and plan for new equipment and materials Ensure defense coverage through process, measurement, inspection, and testing Establish correlations between defense mechanisms to identify improvement opportunities Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control Ensure smooth transition from new product development, qualification, small volume production to high volume production Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields Experiences in semiconductor process and equipment will be advantageous Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis Tenacity to work effectively under timelines and limited resources Consistent track record to solve problems and address root causes Good communication skills Keen in semiconductor industry Showcase leadership potential
