
Etch Process Engineer - Advanced Packaging
- Singapore
- Permanent
- Full-time
- Develop and optimize etch processes for advanced packaging (TSV, plasma dicing, bonding)
- Execute experiments, analyze data, and meet performance/yield/cost targets
- Tool setup, qualification, matching, and troubleshooting
- Drive process robustness using DOE, SPC, and Lean/Six Sigma tools
- Work with equipment and integration teams on productivity and quality improvements
- Support process ownership, reliability testing, and continuous improvement
- Mentor junior engineers and ensure EHS compliance
- Bachelor's or higher in Engineering, Physics, or relevant field
- Hands-on experience in TSV etch, plasma dicing, bonding etch
- Strong data analysis, problem-solving, and cross-functional collaboration skills
- Preferred: Master's or PhD in related field
- Strong communication and interpersonal abilities, especially in cross-cultural settings