Equipment Development: Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity Equipment Tactics: Evaluate and promote new equipment and materials to enhance process capabilities cost, availability, and improve hardware and process capability Quality Improvement: Ensure defense coverage through process, measurement, inspection, and testing Establish correlations between defense mechanisms to identify improvement opportunities Conduct continuous data analysis to establish advanced controls and identify improvement opportunities Collaboration and Coordination: Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control Ensure smooth transition from new product development, qualification, small volume production to high volume production B.S/M.S./Ph.D. (or equivalent education) in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or other related technical fields Understand in semiconductor process or equipment engineering experience would be beneficial Understand in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware would be beneficial Tenacity to work effectively under timelines and limited resources Consistent track record to solve problems and address root causes
