
OSAT] Yield & Process Integration Senior Engineer
- Singapore
- Permanent
- Full-time
- Troubleshoot bumping process (Dry & Wet) issues via DOE
- Analyze yield data and detect trends
- Lead continuous improvement and device qualification projects using APQP
- Execute cost and yield improvement programs (CIP)
- Optimize SPC limits to maintain process control
- Handle customer spec reviews and technical inquiries
- Coordinate BKM (Best Known Method) exercises initiated by customers
- Degree in Engineering
- 3+ years of experience in semiconductor process integration or yield engineering
- Hands-on experience in bumping or front-end wafer fab processes
- Skilled in data analysis, SPC, and APQP methodologies
- Strong analytical, coordination, and problem-solving abilities