- Assist in the setup, execution, and analysis of Flip Chip Attach and Underfill process experiments. - Collaborate with cross-functional teams to troubleshoot and resolve process issues and work on engineering projects. - Apply statistical methods to analyze process data and identify trends or anomalies. - Explore AI-based approaches for predictive modeling and process optimization. Deliverable: - A final presentation summarizing key learnings, challenges, and recommendations. - Contribution to at least one yield improvement or defect reduction initiative. - Development of a simple AI model or script to support process monitoring or defect prediction
