Self-motivated and enthusiastic to find creative solutions to the challenges Passionate about learning semiconductor memory and fabrication. Drive to succeed and ability to energize the team Highly motivated with good analytical and problem-solving skills Excellent written, communication and presentation skills Excellent technical social skills Delayering failing devices using a variety of wet and dry techniques Focused Ion Beam and STEM/TEM usage for cross section analysis and SEM operation for top-down analysis Generate slice and view images for inline process improvement feedback Recognize, identify, and raise awareness of new failure mechanisms with the motivation of "who needs to know this now!" Possess a continuous improvement process (CIP) mindset where you are always looking for ways to improve the operations of the area Demonstrate understanding of physical failure analysis on semiconductor devices ITE or Diploma in an electronics related field or equivalent experience Collaborate with EFA engineering for a quick identification of a visual defect for a yield issue Innovate creative ways improve work efficiency and shorten the time it takes to visualize root cause failures Interpret and summarize the data, and present it to corresponding engineers verbal as well as written. Build and improve new techniques and find exceptional ways to use the existing tools in order to identify new failure mechanism Testing of new processes by evaluating techniques to improve productivity Ownership of PFA tools to maintain maximum up time
