As the Senior Director, Advanced Packaging Technology Development (APTD), you will be directly responsible for building and leading a world class Advanced Packaging Technology Development (APTD) team, carry out package development for high performance products and transfer to manufacturing in accordance with Technology Development business processes. You will ensure organizational compliance to company policies and regulations, departmental procedures, provide organizational leadership and implement continuous improvement. You will be responsible across all aspects of People, Technology, Strategy, and Operations within APTD and will collaborate with internal and external stakeholders to build and execute strategies aligned to organizational and business objectives by delivering high performing and cost-effective packaging solutions on time with highest quality and predictable reliability performance. Technology Development Strategy - understand the impact and implications of APTD strategy to the overall company strategy & direction, developing and communicating APTD strategic objectives Technical Leadership - set strategic and long-term technical objectives aligned with department goals, demonstrate an understanding of technology complexity, and provide technical leadership that may influence company direction, while working effectively with peers across various groups, and representing APTD in cross-department leadership to develop and drive initiatives Impact & Execution - serve as a thought leader who applies knowledge to improve quality, control costs, and enhance production efficiency while managing a significant portion of the budget, while ensuring accuracy, meeting critical deliverables, aligning programs with customer needs, making impactful decisions, handling sensitive communications, and providing long-term recommendations for new programs People Leadership - Build an effective team and optimize department performance and structure, while also identifying and developing future leaders Growth Mindset - Continue to build new skills through development goals and learning events while seeking opportunities to work cross-functionally, build a network, and gain competency across domains You must have at least a bachelor's degree with at least 15 years of proven experience in packaging technology development, high value/high volume manufacturing with at least 5 years in an executive leadership role. You must possess the proven ability to deliver innovative breakthroughs, inspire change, and build consensus with cross-functional teams, customers, and senior leadership. You should also possess a strong sense of product and technical requirements, excellent communication and presentation skills, and the ability to dive into details to resolve complex problems. Possessing knowledge of DRAM/NAND, 3D Packaging Technologies, Chip to Package interaction, BEOL, Reliability and Failure Modes (2.5D, 3DIC, FO, C2W, W2W, etc.), Thermo-Compression Bonding, Hybrid & Fusion Bonding, and Wafer level Technologies is highly preferred. Additionally, you should be willing to travel internationally to meet organizational needs.
