Senior/ Engineer, Advanced Packaging Equipment - Post Wafer Fabrication (PWF)/ Assembly

Micron

  • Singapore
  • Permanent
  • Full-time
  • 2 months ago
Your responsibilities include but are not limited to developing and optimizing next generation, first of a kind (FOAK) wafer and die Equipment for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. Equipment Development: Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity Establish and improve equipment management projects to deliver technode requirements Evaluate and promote new equipment and materials to enhance process capabilities Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing Ensure defense coverage through process, measurement, inspection, and testing Establish correlations between defense mechanisms to identify improvement opportunities Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control Ensure smooth transition from new product development, qualification, small volume production to high volume production B.S/M.S./Ph.D. (or equivalent education) in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or other related technical fields 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field Experience in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware Tenacity to work effectively under timelines and limited resources Consistent track record to solve problems and address root causes

Micron