Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND parts (140s and beyond) Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing CVD/PVD team on the key technology issues that need R&D breakthroughs. Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement Participate with Boise R&D Films peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements Identify disruptive processes early on and work with manufacturing and Boise R&D to identify viable path forward Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions Identify process simplification opportunities and drive cross functional teams in implementation Incorporate best known manufacturing methods into early development phase of upcoming nodes. Design and implement advanced process monitoring and control methodologies. Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers. This position requires communications and collaboration with partners both locally and globally. Be part of the continuous worldwide R&D engagement with suppliers pushing for breakthrough solutions. Bachelor degree or higher in Materials Science, Chemical/Microelectronic Engineering, or Physics with minimum 3 years hands-on experience in leading edge film deposition/implant technology work. Fresh PhD/Masters graduates in Materials Science, Chemical/Microelectronic Engineering or Physics are also welcome to apply. A deep understanding of chemical kinetics, thermodynamics, physical phenomena and their direct application to CVD/PVD deposition in various deposition methods. An ability to understand and troubleshoot precursor depletion effects within three dimensional structures and come up with innovative ideas to mitigate the effects. Basic understanding of films and interface engineering and analysis techniques thereof - SIMS, XPS, EDX, SEM/TEM. Understanding of various integration and structural impacts and constraints related to film deposition processes. An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular. Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data Working knowledge of Design of Experiments (DoE) Proven ability to collaborate with local and overseas teams on projects Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications. Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously Ability to travel for extended periods of time and stay at Boise R&D for 4-6 months at a stretch to work on technology development.
