
Semicon Equipment Technician/ Associate Engineer (Wafer Saw /Laser groove)
- Singapore
- Permanent
- Full-time
- Responsible for maintenance and repair of Wafer Process related systems such as DISCO Wafer SAW (DFD 6360 and DFD6361) and DISCO laser groove
- Perform set-up and conversion to support production
- Develops creative and innovative solutions to problems with considerable initiative and independent thought.
- Acts independently to determine methods and procedures and may provide guidance to less experienced team members
- Communicates with engineers, peer specialist or external vendors to resolve problems and to provide advanced training to less experienced technical specialists
- To identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing costs
- Diploma in Electrical / Electronics / Mechanical / Mechatronics Engineering or its equivalent
- 2 years experience in mass production semiconductor manufacturing environment are preferred
- Certificate of Electrical/ Electronics/ Mechanical/ Mechatronics Engineering or its equivalent with minimum of 3 years experience in semicon equipment support
- Knowledge of practical applications of concepts, procedures and guidelines to solve complex problems
- Knowledge in electronics and mechanical principles and thorough understanding of process technology
- Able to work 12 hour rotating shifts