Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type Participate with Boise TD Films peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions Design and implement advanced process monitoring and control methodologies. Provide advice and counsel to management on significant technical issues. Bachelors/Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Physics or relavant field of studies. A deep understanding of flow dynamics , thermodynamics, physical phenomena and their direct application to Diffusion deposition in various deposition methods. An ability to understand and troubleshoot precursor depletion effects within three dimensional structures and come up with innovative ideas to mitigate the effects. Basic understanding of films and interface engineering and analysis techniques thereof - SIMS, XPS, EDX, SEM/TEM. Understanding of various integration and structural impacts and constraints related to film deposition processes. An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular. Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data Working knowledge of Design of Experiments (DoE) Proven ability to collaborate with local and overseas teams on projects Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications. Proven ability to work in a dynamic environment and able to prioritize and manage multiple projects simultaneously Opportunity to be on overseas assignment for a period of time for technology development work. Innovation, Tenacity, Collaboration and Customer Focus
